IP15 / IP15 Pro / IP15 Pro Max BGA Reballing Stencil is a high-precision stainless steel stencil designed for accurate CPU and IC reballing. It is ideal for professional mobile repair technicians and service centers, offering perfect alignment, durability, and reliable solder ball placement.
Upgrade your mobile repair toolkit with the IP15 / IP15 Pro / IP15 Pro Max BGA Reballing Stencil. Manufactured from premium-grade stainless steel, this stencil delivers precise alignment and consistent solder ball placement, making BGA reballing faster and more accurate.
Whether you are replacing damaged ICs or performing motherboard repairs, this stencil is designed to provide professional-level results with maximum reliability.
