he SAM-2 BGA Reballing Stencil is engineered for professional mobile repair technicians who require precision during Samsung IC reballing. Manufactured from high-grade stainless steel, it ensures excellent durability, accurate alignment, and repeated use without deformation.

Key Features:

• High-quality stainless steel construction.
• Precision laser-cut holes for perfect solder ball alignment.
• Designed for Samsung motherboard IC reballing.
• Heat-resistant and anti-deformation material.
• Suitable for professional BGA rework stations.
• Reusable and long-lasting.
• Lightweight and easy to use.
• Ideal for mobile phone repair workshops and training institutes.
• Provides accurate and reliable reballing results.