The SAM-14 Samsung BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate Samsung IC, CPU, UFS, and eMMC chip reballing. It offers high precision, durability, and is suitable for professional mobile repair technicians.
The SAM-14 Samsung BGA Reballing Stencil is specially manufactured for professional mobile repairing and BGA IC rework. Made from high-grade stainless steel, it provides precise solder ball alignment for Samsung CPU, UFS, eMMC, Power IC, and other BGA chips.
This reusable stencil ensures accurate reballing, minimizes soldering errors, and improves repair efficiency. Whether you're replacing damaged ICs or performing advanced motherboard repairs, the SAM-14 stencil delivers reliable and consistent results.
