The SAM-16 Samsung BGA Reballing Stencil is a high-quality stainless steel stencil designed for precise reballing of Samsung CPU, UFS, eMMC, PMIC and other BGA ICs. It offers accurate alignment, excellent durability, and is ideal for professional mobile repair technicians.
The SAM-16 Samsung BGA Reballing Stencil is manufactured using premium-grade stainless steel to deliver precise and consistent BGA reballing results. It is suitable for repairing Samsung smartphone motherboards and supports accurate solder ball placement for various Samsung ICs.
