SU-2 BGA Reballing Stencil is a high-quality precision stencil designed for accurate IC reballing and solder ball replacement. Manufactured from durable stainless steel, it ensures precise alignment, excellent heat resistance, and long-lasting performance for professional mobile phone repair technicians.
The SU-2 BGA Reballing Stencil is specially engineered for professional mobile repair and BGA IC rework applications. It provides accurate solder ball placement, making chip reballing faster, easier, and more reliable. The stencil is made from premium stainless steel with precision laser-cut holes for consistent solder ball alignment and repeated use.
