The SM-6225 BGA Reballing Stencil is a high-quality stainless steel stencil designed for accurate BGA IC reballing. It provides precise alignment for CPU, UFS, eMMC, and other mobile ICs, making it an essential tool for professional mobile phone repair technicians.
The SM-6225 BGA Reballing Stencil is manufactured from premium-grade stainless steel to ensure long-lasting performance and accurate solder ball placement. It is designed for professional mobile repairing, offering excellent precision while repairing damaged or faulty ICs.
