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HW-2 CPU Reballing Stencil

₹180 ₹ 200 10%
Availability: In Stock

HW-2 CPU Reballing Stencil is a high-quality precision stencil designed for accurate BGA CPU reballing and chip repair. Manufactured from premium stainless steel, it provides excellent heat resistance, durability, and precise alignment for professional mobile phone repair technicians.

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Categories: Mobile Repair Tools
SKU code:HW-2
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No 1 Brand Mobile Tools
Product Description -:

The HW-2 CPU Reballing Stencil is specially designed for professional mobile repair engineers who require precise and reliable CPU reballing. Its premium stainless steel construction ensures long-lasting performance while maintaining perfect alignment during solder ball placement.

Features:

  • Premium stainless steel construction
  • High precision laser-cut holes
  • Accurate BGA reballing performance
  • Heat-resistant and anti-deformation design
  • Reusable and long-lasting
  • Smooth surface for easy cleaning
  • Suitable for professional mobile repairing
  • Compatible with various supported CPU chip models
  • Ideal for service centers and repair laboratories
  • Lightweight and easy to use

 

 

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