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HW-5 BGA Reballing Stencil for Mobile CPU & IC Repair

₹180 ₹ 200 10%
Availability: In Stock

HW-5 Stencil is a premium-quality BGA reballing stencil specially designed for professional mobile repairing. It provides precise solder ball alignment for CPU, IC, and chipset reballing, ensuring accurate and reliable repair results.

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Categories: Mobile Repair Tools
SKU code:HW-5
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No 1 Brand Mobile Tools
Product Description -:

HW-5 BGA Reballing Stencil Features

  • Premium stainless steel construction for long-lasting durability.
  • High-precision laser-cut holes for accurate solder ball placement.
  • Designed for professional CPU, IC & chipset reballing.
  • Heat-resistant material suitable for repeated use.
  • Provides excellent alignment during BGA rework.
  • Ideal for repairing damaged solder joints on mobile motherboards.
  • Compatible with hot air stations and BGA rework machines.
  • Smooth surface finish for easy cleaning and maintenance.
  • Lightweight and portable design.
  • Suitable for mobile repair shops, technicians, and training institutes.

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