ONE+12 CPU Stencil is a high-precision BGA reballing stencil specially designed for mobile phone CPU and IC repair. Manufactured with premium stainless steel, it offers accurate alignment, high durability, and professional-grade performance for mobile repair technicians.
The ONE+12 CPU Reballing Stencil is an essential tool for professional mobile repair engineers. It is designed for accurate CPU and IC reballing, ensuring precise solder ball placement and reliable repair results.
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