The MU-5 BGA Reballing Stencil is a premium stainless steel stencil designed for accurate IC, CPU, UFS, and eMMC reballing in smartphone motherboard repair. It offers precise alignment, excellent durability, and is ideal for professional mobile repair technicians.
The MU-5 BGA Reballing Stencil is manufactured from high-quality stainless steel to deliver precise and reliable BGA reballing results. It is designed for professional technicians performing motherboard repairs, IC replacement, CPU reballing, UFS, and eMMC chip work.
Its laser-cut holes ensure accurate solder ball placement while maintaining long-lasting performance for repeated use. The stencil is resistant to heat, corrosion, and deformation, making it an essential tool for every mobile repair workshop.
