The MP2 Stencil is a high-precision reballing stencil designed for professional mobile phone motherboard and IC repair. Made from premium stainless steel, it provides accurate alignment, excellent durability, and smooth solder ball placement for reliable BGA reballing.
The MP2 Stencil is specially designed for technicians who require precise and consistent BGA reballing. Manufactured from high-quality stainless steel, it offers excellent heat resistance and long-lasting performance for daily repair work.
