iPad 5 / iPad Mini 2 BGA Reballing Stencil is specially designed for professional mobile repair technicians. It helps rebuild damaged BGA IC solder balls with high precision, making motherboard repair faster and more reliable.

Features:

• Compatible with iPad 5 & iPad Mini 2
• Premium quality stainless steel material
• High-precision laser-cut holes
• Perfect alignment for accurate reballing
• Heat-resistant and anti-deformation design
• Reusable for long-term professional use
• Suitable for CPU, NAND, Power IC, and other BGA IC repairs
• Ideal for mobile repair shops, training institutes, and technicians
• Provides smooth and accurate solder ball placement
• Lightweight and easy to use