SAM-9 BGA Reballing Stencil is a premium-quality stainless steel stencil specially designed for Samsung IC chip reballing. It offers accurate alignment, high heat resistance, and long-lasting durability, making it an ideal choice for professional mobile phone technicians and repair centers.
The SAM-9 Stencil is manufactured using high-grade stainless steel to ensure precise solder ball placement during Samsung BGA IC reballing. Its laser-cut design delivers perfect alignment, helping technicians perform reliable and accurate chip repairs.
