SU-3 BGA Reballing Stencil – Professional Mobile IC Repair Tool

The SU-3 BGA Reballing Stencil is manufactured using premium-quality stainless steel to ensure precision and durability during IC reballing. It is suitable for repairing mobile motherboard BGA chips and provides accurate alignment for solder balls, helping technicians achieve reliable repair results.

Key Features:

• High-quality stainless steel construction
• Precision laser-cut holes for accurate solder ball placement
• Heat-resistant and corrosion-resistant material
• Reusable and long-lasting design
• Ideal for professional mobile repair technicians
• Smooth surface for easy cleaning and maintenance
• Compatible with BGA reballing and motherboard repair work
• Lightweight and easy to handle