The USMG-2 Universal BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate IC, CPU, eMMC, UFS, and PMIC reballing. Its precise hole alignment, heat-resistant construction, and reusable design make it an ideal choice for professional mobile phone repair technicians.
The USMG-2 Universal BGA Reballing Stencil is engineered to provide precise and reliable solder ball placement during BGA IC reballing. Manufactured from high-grade stainless steel, it ensures long-lasting durability and consistent performance even after repeated use.
Suitable for repairing a wide range of smartphone motherboard ICs, the USMG-2 stencil delivers excellent accuracy, helping technicians achieve clean and professional reballing results.
