IP8P/8/X Stencil is a high-precision BGA reballing stencil specially designed for iPhone 8 Plus, iPhone 8, and iPhone X motherboard repair. Manufactured with premium stainless steel, it provides accurate alignment, excellent heat resistance, and long-lasting durability for professional mobile technicians.
The IP8P/8/X Stencil is engineered for technicians performing advanced motherboard repairs on iPhone 8 Plus, iPhone 8, and iPhone X. It ensures precise solder ball placement for CPU, IC, and BGA chip reballing, helping achieve reliable repair results.
