The iPhone 12 / 12 Pro / 12 Pro Max BGA Reballing Stencil is specially designed for professional motherboard repairing and IC reballing. Manufactured using high-quality stainless steel, it provides precise alignment for CPU, NAND, PMIC, and other IC reballing applications.

Features:

• Compatible with iPhone 12, iPhone 12 Pro & iPhone 12 Pro Max
• High-quality stainless steel construction
• Ultra-precision laser-cut hole design
• Perfect alignment for accurate solder ball placement
• Heat-resistant and corrosion-resistant
• Reusable and durable for long-term use
• Ideal for CPU, NAND, PMIC and motherboard IC reballing
• Suitable for professional mobile repair technicians and repair centers