UQSD-7 Universal BGA Reballing Stencil is a high-precision stainless steel stencil designed for accurate IC reballing and soldering. It is ideal for repairing CPU, eMMC, UFS, PMIC, and other BGA ICs used in smartphone motherboard repair.
The UQSD-7 Universal BGA Reballing Stencil is manufactured using premium-quality stainless steel to ensure excellent durability, heat resistance, and long service life. It provides precise alignment for solder balls, making BGA reballing easier, faster, and more accurate.
Whether you are a beginner or a professional mobile repair technician, this stencil helps achieve reliable soldering results with minimal effort.
