The MI-16 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate reballing of mobile BGA ICs. It offers precise alignment, excellent heat resistance, and long-lasting durability, making it ideal for professional mobile repair technicians and repair centers.
The MI-16 BGA Reballing Stencil is manufactured from high-grade stainless steel to deliver accurate and reliable BGA reballing results. Designed for precision work, it helps technicians repair CPU, eMMC, UFS, Power IC, and other BGA chips with ease.
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