The MQ-3 Stencil is specially designed for professional smartphone motherboard repair. Manufactured from high-quality stainless steel, it offers excellent durability, precise hole alignment, and superior heat resistance, making it ideal for repeated use during BGA IC reballing.

Features:

• High-quality stainless steel construction
• Precision laser-cut holes for accurate reballing
• Heat-resistant and durable design
• Smooth surface for easy solder ball placement
• Reusable for long-term professional use
• Lightweight and easy to handle
• Suitable for mobile phone motherboard repair
• Ideal for professional technicians and repair centers
• Provides consistent and accurate solder ball alignment
• Compatible with advanced reballing techniques