The MAX-1 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate IC reballing and motherboard repair. It offers precise hole alignment, excellent durability, and is suitable for professional mobile phone technicians.
The MAX-1 Stencil is specially designed for precision BGA IC reballing in mobile phone motherboard repairs. Manufactured from premium stainless steel, it ensures accurate solder ball placement, long-lasting durability, and consistent repair performance.
