The SAM-12 Samsung BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate Samsung CPU, UFS, eMMC, PMIC and IC reballing. It offers precise alignment, high durability, and reusable performance, making it an essential tool for professional mobile repair technicians.
The SAM-12 Samsung BGA Reballing Stencil is specially engineered to deliver precise and reliable reballing results for Samsung smartphone motherboards. Manufactured from high-grade stainless steel, it ensures excellent heat resistance, long life, and accurate solder ball placement.
