SAM-4 Stencil is a premium-quality BGA reballing stencil designed for Samsung motherboard IC repair. Manufactured from high-grade stainless steel, it offers precise alignment, excellent heat resistance, and long-lasting durability for accurate solder ball reballing.
The SAM-4 BGA Reballing Stencil is specially designed for professional mobile repair technicians working on Samsung smartphone motherboards. It provides precise BGA alignment, making IC reballing faster, easier, and more reliable.
