The UQSD-6 BGA Reballing Stencil is manufactured from premium-quality stainless steel to ensure precise solder ball placement during BGA IC reballing. It is suitable for professional mobile repair shops, service centers, and technicians who require accurate and repeatable repair results.

Key Features:

• Premium stainless steel construction.
• High precision laser-cut holes.
• Accurate IC alignment for easy reballing.
• Heat-resistant and corrosion-resistant.
• Durable and reusable for long-term use.
• Smooth surface for quick cleaning.
• Ideal for professional mobile repairing
• Lightweight and portable design.
• Provides consistent solder ball positioning.
• Suitable for advanced BGA repair applications.