High-quality iPad 3 / iPad 4 BGA Reballing Stencil designed for accurate IC reballing and motherboard repair. Manufactured from premium stainless steel for precise solder ball alignment, durability, and long-lasting performance. Perfect for professional mobile repair technicians and service centers.
The iPad 3 / iPad 4 BGA Reballing Stencil is specially designed for professional motherboard repair and IC reballing applications. Made from premium-grade stainless steel, this stencil ensures accurate solder ball placement for CPU, NAND, Power IC, and other BGA components found in iPad 3 and iPad 4 devices.
