MAK-2 BGA Reballing Stencil is a high-precision stainless steel stencil designed for accurate CPU and IC reballing. It provides perfect alignment, excellent durability, and professional repair results for mobile technicians.
The MAK-2 BGA Reballing Stencil is manufactured using premium quality stainless steel for precise solder ball placement during mobile motherboard repair. It is suitable for professional technicians and repair centers requiring accurate CPU and IC reballing.
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