The MP1 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone repairing. Manufactured from premium stainless steel, it ensures accurate solder ball placement, excellent heat resistance, and long-lasting durability for reliable IC reballing.
The MP1 Stencil is specially designed for technicians performing precision BGA and IC reballing on mobile phone motherboards. Its high-quality stainless steel construction provides excellent durability, precise alignment, and repeated usage without deformation.
