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HW-3 CPU Reballing Stencil | Mobile Repair BGA Stencil

₹180 ₹ 200 10%
Availability: In Stock

HW-3 Stencil is a premium-quality BGA reballing stencil designed for accurate CPU reballing in mobile phone motherboard repair. Manufactured from high-grade stainless steel, it offers precise hole alignment, excellent durability, and consistent solder ball placement for professional technicians.

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Categories: Mobile Repair Tools
SKU code:HW-3
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No 1 Brand Mobile Tools
Product Description -:

The HW-3 Stencil is specially designed for professional mobile repairing engineers who require accurate and reliable CPU reballing. Its laser-cut stainless steel construction ensures precise alignment and long-lasting performance, making motherboard repairs faster and more efficient.

Key Features

  • Premium stainless steel construction
  • High-precision laser-cut holes
  • Accurate solder ball positioning
  • Heat-resistant and durable design
  • Reusable for multiple repair jobs
  • Smooth surface for easy cleaning
  • Ideal for professional mobile repair technicians
  • Suitable for CPU and BGA IC reballing applications
  • Lightweight and easy to use
  • Delivers consistent repair results

Applications

  • Mobile CPU Reballing
  • BGA IC Repair
  • Smartphone Motherboard Repair
  • Professional Mobile Repair Workshops
  • Electronics Repair Centers

 

 

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