High-quality iPhone 11 / 11 Pro / 11 Pro Max BGA Reballing Stencil designed for precise IC reballing and motherboard repair. Manufactured from durable stainless steel for accurate alignment, clean solder ball placement, and long-lasting performance.
The iPhone 11 / 11 Pro / 11 Pro Max BGA Reballing Stencil is an essential tool for professional mobile repair technicians. It is specially designed for accurate reballing of motherboard ICs used in the iPhone 11 series. Precision laser-cut holes ensure perfect solder ball positioning, reducing repair time and improving success rates.
