The MI-13 BGA Reballing Stencil is a premium stainless steel stencil designed for precise reballing of Xiaomi smartphone CPU, eMMC, UFS, and power ICs. It offers excellent durability, accurate hole alignment, and is ideal for professional mobile repair technicians.
The MI-13 BGA Reballing Stencil is manufactured from high-quality stainless steel to deliver accurate and reliable BGA reballing results. Designed specifically for Xiaomi motherboard repairs, it ensures perfect solder ball alignment, making IC replacement faster and more efficient.
Suitable for repairing CPU, UFS, eMMC, PMIC, and other BGA chips used in various Xiaomi smartphones.
