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MAK-5 BGA Reballing Stencil

₹180 ₹ 200 10%
Availability: In Stock

MAK-5 Stencil is a high-quality precision BGA reballing stencil designed for accurate solder ball rework on mobile ICs. Made from durable stainless steel, it provides excellent heat resistance, long life, and precise alignment for professional mobile repair technician

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Categories: Mobile Repair Tools
SKU code:MAK-5
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No 1 Brand Mobile Tools
Product Description -:

The MAK-5 Stencil is specially designed for precise BGA reballing and IC repair. It is manufactured using premium stainless steel to ensure durability, accurate hole positioning, and consistent performance during repeated use.

Features:

  • Premium quality stainless steel construction
  • High precision laser-cut holes
  • Perfect for mobile CPU & BGA IC reballing
  • Excellent heat resistance
  • Smooth surface for easy solder ball placement
  • Long-lasting and reusable
  • Accurate alignment for professional repairs
  • Suitable for mobile repairing laboratories and technicians
  • Lightweight and easy to use
  • Ideal for advanced motherboard repairing

 

 

 
 
 
 
 

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