Z Fold4 CPU Stencil – Professional BGA Reballing Tool

The Z Fold4 CPU Stencil is manufactured from premium-quality stainless steel to deliver accurate and consistent CPU reballing results. Designed specifically for the Samsung Galaxy Z Fold4 motherboard, it ensures perfect alignment of solder balls during CPU repair and replacement.

Key Features:

• Designed specifically for Samsung Galaxy Z Fold4 CPU
• High-quality stainless steel construction
• Precision laser-cut holes for accurate ball placement
• Heat-resistant and durable for repeated use
• Ensures perfect BGA reballing alignment
• Ideal for CPU repair and motherboard rework
• Reusable and corrosion-resistant
• Suitable for professional mobile repair technicians
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