The MI-15 BGA Reballing Stencil is a premium stainless steel stencil designed for accurate Xiaomi, Redmi, and POCO IC, CPU, UFS, and eMMC reballing. It offers precise alignment, excellent durability, and is ideal for professional mobile repair technicians.
The MI-15 BGA Reballing Stencil is manufactured using high-quality stainless steel to provide precise and reliable reballing for Xiaomi, Redmi, and POCO motherboard ICs. Designed for professional repair technicians, it ensures perfect solder ball alignment, helping improve repair quality and reduce rework.
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