High-performance solder paste from FONEKONG — model PPD FKGL42, designed for precise repair work, with a melting point of 183 °C and comes in a 42 g size. Ideal for mobile-board and BGA repairs.
Brand: FONEKONG
Model: PPD FKGL42
Melting point: 183 °C (ensuring reliable reflow performance)
Net weight: 42 g
Specifically designed for precision electronics repair such as BGA, mobile phone motherboards and fine-pitch components
Ensures good wetting, strong joint integrity and consistent reflow results
Industrial grade: Contains lead (for industrial use only) — use with adequate ventilation, avoid repeated contact with skin/eyes, avoid inhaling vapour, keep away from children.
Comes in convenient size for repair technicians, enabling efficient workflow without waste.
Compatible with standard rework stations, hot air guns and reflow ovens used in mobile-device and PCB repair environments.
Helps reduce repair time and improve joint reliability in high-density boards.
