Brand: FONEKONG

Model: PPD FKGL42

Melting point: 183 °C (ensuring reliable reflow performance)

Net weight: 42 g

Specifically designed for precision electronics repair such as BGA, mobile phone motherboards and fine-pitch components

Ensures good wetting, strong joint integrity and consistent reflow results

Industrial grade: Contains lead (for industrial use only) — use with adequate ventilation, avoid repeated contact with skin/eyes, avoid inhaling vapour, keep away from children.

Comes in convenient size for repair technicians, enabling efficient workflow without waste.

Compatible with standard rework stations, hot air guns and reflow ovens used in mobile-device and PCB repair environments.

Helps reduce repair time and improve joint reliability in high-density boards.