The OV-7 BGA Reballing Stencil is a high-quality precision stencil designed for accurate IC reballing and motherboard repair. Made from durable stainless steel, it ensures precise solder ball placement, high heat resistance, and long-lasting performance for professional mobile repair technicians.
The OV-7 BGA Reballing Stencil is specially designed for professional mobile repair engineers who require accurate and reliable IC reballing. Manufactured using premium stainless steel, it offers excellent durability, precise hole alignment, and consistent solder ball positioning.
Whether you're repairing smartphone motherboards or replacing damaged BGA ICs, the OV-7 stencil helps achieve clean and accurate reballing results while reducing repair time.
