HI-2 CPU Reballing Stencil is a premium-quality BGA stencil designed for accurate CPU IC reballing and repair. Manufactured from high-grade stainless steel, it provides precise alignment, excellent heat resistance, and long-lasting performance for professional mobile repair technicians.
The HI-2 CPU Reballing Stencil is specially designed for professional mobile repairing applications. It enables accurate solder ball placement during CPU IC reballing, ensuring reliable repairs and stable performance. Built from durable stainless steel, this stencil offers excellent heat resistance and can withstand repeated use without deformation.
