The FONEKONG PPD FKGL42 solder paste is specially formulated for electronics repair work requiring a lower melting point, making it well-suited for delicate components and BGA rework. Key features include:

• Melting point of 138 °C, enabling reduced thermal stress on sensitive boards.

• 42 g packaging — practical size for repair labs and technicians.

• Lead-free composition (if applicable – please confirm with supplier).

• Excellent wetting and flow characteristics ensure consistent solder joint quality.

• Ideal for mobile phone motherboard repair, PCB rework, BGA/CPU chip soldering, and fine pitch component fix.

• Branded by FONEKONG, trusted in the electronics repair industry.

• Helps minimize heat damage and improves reliability of solder joints during rework.

Usage tips: Use appropriate stencil or dispensing for consistent application. Ensure board is clean and flux residues removed after reflow. Store in cool, dry place and reseal after use to maintain paste integrity.