he SAM-15 Samsung BGA Reballing Stencil is a premium-quality stainless steel stencil designed for precise reballing of Samsung CPU, UFS, eMMC, PMIC, and other BGA ICs. It offers accurate alignment, excellent durability, and is ideal for professional mobile repair technicians.
The SAM-15 Samsung BGA Reballing Stencil is engineered to provide accurate and reliable BGA reballing for Samsung motherboard ICs. Manufactured from premium stainless steel, it ensures long-lasting performance, high heat resistance, and precise solder ball alignment.
Whether you're repairing Samsung smartphones or performing advanced motherboard work, this stencil helps achieve professional-quality results with minimal effort.
