U-2 Stencil is a high-precision BGA reballing stencil designed for mobile CPU chip repair and rework. Manufactured from premium stainless steel, it provides accurate alignment, high durability, and professional-grade performance for mobile repairing technicians.
The HU-2 BGA Reballing Stencil is specially designed for professional mobile phone repair technicians. It enables precise solder ball placement during CPU reballing and chip repair. Made from premium-quality stainless steel, this stencil offers excellent heat resistance, long-lasting durability, and accurate alignment for reliable repair results.
