AU3 (IP CPU) Stencil is a high-precision BGA reballing stencil specially designed for iPhone CPU repair. Manufactured with premium stainless steel, it ensures accurate solder ball alignment, excellent durability, and professional repair results for mobile technicians.
The AU3 (IP CPU) Stencil is a premium-quality reballing stencil developed for accurate iPhone CPU BGA rework. Its precision-cut holes provide perfect solder ball positioning, making CPU reballing faster, easier, and more reliable.