Unlock precision and reliability in your electronics repair work with the FONEKONG PPD FKGL42 solder paste. Engineered for mobile phone and motherboard repair, this high-performance formula offers:

• Melting (reflow) temperature around 158 °C, enabling safer soldering of sensitive components.

• Pack size: 42 g, allowing you convenient quantity for job-site use.

• Designed for PCBA, BGA and mobile repair use-cases where low thermal impact is important.

• Consistent paste quality, fine flux distribution and reliable wetting, which help achieve strong joints and reduce voids.

• Compatible with typical rework stations, hot-air tools or reflow platforms commonly used in mobile repair workshops.

• From trusted brand FONEKONG – known for repair-tools accessories and materials in electronics service industry.

Whether you’re repairing flagship smartphones, tablets or PC motherboards, the FKGL42 model helps you maintain high repair yield and protect vulnerable components from heat damage. Add this to your workshop inventory and give your customers repairs you can trust.