The MECHANIC Magic Tag Solder Piece is engineered for mobile phone motherboard repairs, particularly for restoring damaged solder joints or missing pads. Instead of looping jumper wires, this pad allows direct pad restoration and welding for a clean, efficient fix.
Features:

• Reinforced fixed pins hold the pad securely in place — no risk of falling off. 

• Uses industrial-grade printed circuit board copper foil (≈30 µm thickness) for reliable performance. 

• Excellent flatness ensures minimal false soldering caused by uneven surfaces. 

• BGA bonding surface is highly saturated and stable—good electrical performance and strong weld strength; not prone to dropping off or unsoldering.

• Secure connection point to the circuit board, with strong green-oil fixation. 

• Saves time and effort by eliminating the need for flying wires or loops; improves repair efficiency significantly.

• Applicable for dot-faded soldering pads of various shapes and models. Enables seamless pad repair so that the board can be reinstalled without traces of jump wires.