UQSD-4 BGA Reballing Stencil – Professional Mobile Repair Tool

The UQSD-4 Stencil is specially designed for precision BGA IC reballing in mobile phone motherboard repair. Manufactured from premium stainless steel, it ensures accurate solder ball placement and delivers consistent results during chip rework.

Key Features:

• High-quality stainless steel construction.
• Precision laser-cut holes for accurate solder ball alignment.
• High temperature resistant and anti-warp design.
• Reusable, durable, and corrosion-resistant.
• Smooth surface for easy cleaning after use.
• Ideal for professional mobile repair technicians.
• Suitable for BGA IC reballing and motherboard repair.
• Lightweight and easy to handle.
• Long service life with excellent performance.