MI-12 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for precise reballing of Xiaomi CPU, UFS, eMMC, PMIC and other BGA ICs. It provides accurate alignment, excellent durability, and consistent results for professional mobile repair technicians.
The MI-12 BGA Reballing Stencil is specially designed for Xiaomi motherboard repair and BGA IC reballing. Manufactured from high-grade stainless steel, it delivers precise solder ball placement for CPU, UFS, eMMC, PMIC and other Xiaomi ICs. The stencil is laser-cut for maximum accuracy and can withstand repeated use without losing precision.
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