The HW-9 Stencil is specially designed for professional mobile repair engineers who perform CPU and IC reballing. Made from premium stainless steel with precision laser-cut holes, it ensures accurate solder ball alignment and consistent reballing results.

Key Features:

• High-quality stainless steel construction.
• Precision laser-cut hole pattern.
• Accurate alignment for CPU & IC reballing.
• Heat-resistant and corrosion-resistant material.
• Reusable with long service life.
• Smooth surface for easy solder ball placement.
• Professional-grade quality for repair shops.
• Lightweight and easy to carry.
• Ideal for advanced motherboard repairing.
• Compatible with professional BGA rework processes.