The USMG-1 Universal BGA Reballing Stencil is a high-quality stainless steel stencil designed for accurate BGA IC reballing. It provides precise solder ball alignment and is suitable for repairing various mobile CPU, eMMC, UFS, and power management ICs.
The USMG-1 Universal BGA Reballing Stencil is an essential tool for professional mobile repair technicians. Manufactured from premium stainless steel, it offers excellent durability, heat resistance, and long-lasting performance. Its precision laser-cut holes ensure accurate solder ball placement, making BGA reballing faster and more reliable.
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