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SAM-11 BGA Reballing Stencil for Samsung Mobile IC Repair

₹180 ₹ 200 10%
Availability: In Stock

SAM-11 Stencil is a high-precision BGA reballing stencil specially designed for Samsung smartphone motherboard IC repair. Manufactured from premium stainless steel, it provides accurate solder ball alignment, excellent durability, and professional repair performance.G

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Categories: Mobile Repair Tools
SKU code:SAM-11
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No 1 Brand Mobile Tools
Product Description -:

The SAM-11 BGA Reballing Stencil is an essential tool for professional mobile repair technicians. It is engineered for precise Samsung IC reballing and motherboard repair, ensuring accurate solder ball placement with consistent results.

Key Features:

  • Precision laser-cut stainless steel stencil.
  • Designed specifically for Samsung mobile IC reballing.
  • High temperature resistant and reusable.
  • Accurate BGA ball alignment.
  • Durable, anti-rust, and long-lasting construction.
  • Suitable for CPU, UFS, eMMC, PMIC and other Samsung IC repairs.
  • Compatible with hot air and BGA rework stations.
  • Ideal for professional mobile repairing workshops and service centers.
  • Easy to clean and maintain.
  • Delivers reliable and consistent repair results.

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