The OV-5 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for precise reballing of mobile ICs, CPUs, eMMC, UFS and other BGA chips. It offers accurate alignment, high durability, and reliable performance for professional mobile repair technicians.
The OV-5 BGA Reballing Stencil is manufactured from high-grade stainless steel to ensure long-lasting durability and precision during BGA reballing. It is ideal for repairing damaged solder balls on mobile ICs and provides consistent results in professional repair environments.
