IP6S/6SP Stencil is a premium-quality BGA reballing stencil designed specifically for iPhone 6S and iPhone 6S Plus motherboard repairs. It delivers precise IC alignment for CPU, NAND, Power IC, and other chip reballing, making it an essential tool for professional mobile repair technicians.
The IP6S/6SP Stencil is engineered to provide accurate and reliable reballing for iPhone 6S and iPhone 6S Plus logic boards. Manufactured from high-grade stainless steel, it ensures excellent durability, heat resistance, and precise solder ball positioning for professional chip-level repairs.
