The SSD-4 BGA Reballing Stencil is a premium-quality precision stencil designed for accurate IC reballing and motherboard repair. Manufactured from durable stainless steel, it offers excellent heat resistance, precise alignment, and long-lasting performance for professional mobile repair technicians.
he SSD-4 Stencil is specially designed to simplify the BGA reballing process for smartphone motherboard repairs. Its high-precision hole alignment ensures accurate solder ball placement, reducing repair time while improving success rates.
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